Question about thermal paste application methods

I was watching a repair video from an ITAD facility last week and saw they use a cross pattern on CPUs instead of the pea method everyone swears by. They claimed it cuts rejection rates by 15 percent on Ryzen chips. I looked up some thermal interface material studies and found the data backs them up on larger dies. Has anyone else seen better results with different patterns on specific processors?

2 comments

2 Comments

blairf489d ago

@evaperez saw that same video. The cross pattern spread better on my 3900X too.

evaperez9d ago

Wait, have you actually tested this yourself? I swapped to the cross method on my 5900X last year and my temps dropped like 3 degrees, swear to god the pea method was leaving dry spots on the edges.